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 New Dow Corning® DA-6650 Adhesive Formulated to Improve Production and Reliability of Sensitive MEMS Sensors

 

Source:dowcorning.com      EditEllsworth Adhesives

 

 

Dow Corning, a wholly owned subsidiary of The Dow Chemical Company and a global leader in silicones, silicon-based technology and innovation, today introduced an advanced new material to its growing portfolio of solutions for sensors based on micro-electromechanical systems (MEMS). Dow Corning, a wholly owned subsidiary of The Dow Chemical Company and a global leader in silicones, silicon-based technology and innovation, today introduced an advanced new material to its growing portfolio of solutions for sensors based on micro-electromechanical systems (MEMS). New  Dow Corning® DA-6650 Die Attach Adhesive combines low modulus across a wide temperature range with a proprietary filler technology to minimize cracking of small MEMS dies during packaging assembly. Suitable for single or stacked chips, Dow Corning’s new adhesive can help improve both the yield and reliability of camera sensors and sensitive MEMS sensors used to measure pressure, temperature and other metrics.

 

 

"MEMS sensor applications continue to grow rapidly, which is increasing the already considerable pressure on packaging assembly houses and MEMs designers to improve the yield and quality of their products," said Gary Aw, marketing manager for Dow Corning. "This innovative new material exemplifies Dow Corning’s proactive and collaborative approach to solving industry challenges. Through our close, collaborative relationships with customers, Dow Corning was able to tailor new DA-6650 Adhesive specifically to address their most demanding assembly issues and meet the needs of this fast-growing sector."


 

Available as a one-part silicone formulation, Dow Corning DA-6650 Die Attach Adhesive has an innovative silicone elastomer filler that absorbs mechanical stress during the die attach process, which helps to minimize cracking and maximize yields. Once cured, the material maintains a low 3.9MPa modulus at temperatures between -55°C and 200°C to enable MEMS sensors to deliver consistent measurements as temperatures cycle across a wide range.


 

Dow Corning DA-6650 Die Attach Adhesive is a solventless material with low moisture absorption. Like other silicones in Dow Corning’s advanced assembly portfolio, it offers superior thermal stability vs. organic materials.



About Dow Corning

 

 

Dow Corning (dowcorning.com), a wholly owned subsidiary of The Dow Chemical Company, provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and  XIAMETER® brands. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative , a stringent set of standards designed to advance the safe and secure management of chemical products and processes.



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