Part number: Epoxy Hybrid Polymer 131-77MXManufacturer SKU:
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DescriptionHybrid Polymer 131-77MX is a transparent, room temperature curing, two-part, epoxy-based system designed to encapsulate small to medium-sized electronic packages. This product provides excellent moisture, chemical, and physical shock resistance properties, ideal for protection against harsh environments. Hybrid Polymer 131-77MX also bonds readily to polycarbonate, nylon, and metal, making it a supreme choice for electronics encapsulation.
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Product Details
Typical Use: Moderate work life (30 minutes) clear epoxy encapsulant for electronics. Excellent resistance to water and water vapor, many chemicals, excellent bonds to polycarbonate and nylon.
Components: 2 Part Epoxy Color
Clear
Viscosity 4,700cps
Hardness: D35 Elongation 90% Operating Temperature -60 to 135℃ Applications Electronics encapsulating
Plotting RF Transmitters
Features Convenient mix ratio
Moisture and chemically resistant
Room temperature cure
Physical shock resistant
Low shrinkage
Non-Acrylate Containing
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SDS / TDS
