Preparing substrate surfaces meticulously before utilizing light-curable materials is critical to achieving reliable bonds.

Enhance the Bond Strength of Light-Curable Materials with Dyne Level Insights In the realm of material science and engineering, particularly in fields that leverage adhesives for assembly or coating applications, the concept of dyne level plays a pivotal role. The dyne level, often expressed in dynes/cm (dyn/cm), is a measure of surface energy, with higher values indicative of a material's wettability.

When selecting the best adhesive for your application, light-curable adhesives often stand out for their fast cure times, versatility, and environmental friendliness. However, each type of adhesive—whether epoxies, urethanes, silicones, hot melts, solvent-based adhesives, or cyanoacrylates—has unique properties that may make it a better choice depending on your specific requirements. Here’s a comprehensive comparison to help you choose the best product for your project.

In the rapidly evolving electronics landscape, ensuring the reliability and longevity of printed circuit boards (PCBs) is paramount. Conformal coatings have long served as a protective shield against environmental factors such as moisture, corrosion, and thermal stress. However, as technology advances, traditional conformal coatings face new challenges, particularly with modern PCB designs.

HumiSeal® UV550 offers durable, flexible protection for PCBs with UV curing technology, ideal for aerospace, automotive, industrial, and consumer electronics applications.