From automotive to telecommunications to computing and power conversion applications, form factors continue to decrease and power densities are on the rise. The never-ending push to pack more function into smaller spaces puts tremendous pressure on thermal management materials.

communications realm and into health, fitness, entertainment, transportation and more. With this reliance on smartphones, fitness bands and connected watches also comes huge expectations: expectations for reliability, expectations for enormous functionality, expectations for exceptional design and, yes, expectations for extreme durability.

3M™ Scotch-Weld™ Epoxy Adhesive DP-460EG is designed to have lower outgassing and lower ionics than 3M™ Scotch-Weld™ Epoxy Adhesive DP-460.

Flexible, high-strength anaerobic gasketing material for use on rigid iron, aluminum and steel flanged mating surfaces.

Concerned about the long-term reliability of dispensed, non-curing thermal interface solutions? What about cracking and pump-out that increase thermal resistance after aging and thermal shock? These are just a few of many important reasons to consider using pre-cured pads as a thermal transfer medium between a heat spreader and electrical components over wet-dispensed products that are prone to failure over time as in the example provided below.