Part number: 325 50 GRAM KIT 1 TO 1Manufacturer SKU:
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DescriptionDynaloy 325 Epoxy Adhesive Silver is a two component, room temperature curing, thixotropic paste that is used to replace metal solder on heat sensitive components, print circuit boards, ground wires, and wave guide plumbing. It is self leveling and has good electric conductivity. 50 g Kit.
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Product Details
Typical Use: Applications include RFI and EMI shielding, chip bonding for discrete devices and hybrid circuits, connecting ground wires to components and making conductive lines, and connecting heat sensitive components to printed circuit boards. Color: Silver Components: 2 part Cure System: Room Temperature/Heat Cure Time: 24h @ room temperature; 2h @ 60 °C; 15 to 20min @ 150 °C Mix Ratio: 1:1 Service Temperature: -60 to 175 °C Shear Strength: 1,200 to 2,500 Thermal Conductivity: 25 x 10^-4 W/mK Volume Resistivity: Room Cured: 0.006 ohm-cm; Heat Cured: 0.003 ohm-cm Working Time: 1 to 2h @ room temperature -
SDS / TDS
