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DescriptionDYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and heat curing, acrylated urethane that is used for bonding electronic devices, print circuit boards, glass, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and resistance to thermal cycle and moisture. 10 mL MR Syringe.
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Product Details
Typical Use: Multi-Cure 9001-E-V3 series encapsulants display excellent adhesion to PC boards and electronic components and are especially well suited for chip on board, chip on flex, and multi-chip modules. Brand: Multi-Cure Chemical Composition: Modified urethane Color: Clear Components: 1 part Cure System: UV Dielectric Strength: 500 V/mil Elongation: 75% @ break Flash Point: 108 °C Hardness: 42 D Tensile Strength: 1,000 psi @ break Viscosity: 45,000 Volume Resistivity: 555 x 10^12 ohm-cm -
SDS / TDS