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DescriptionDYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and heat curing, acrylated urethane that is used for bonding electronic devices, print circuit boards, glass, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and resistance to thermal cycle and moisture. 30 mL MR Syringe.
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Product Details
Typical Use: Multi-Cure 9001-E-V3 series encapsulants display excellent adhesion to PC boards and electronic components and are especially well suited for chip on board, chip on flex, and multi-chip modules. Brand: Multi-Cure Chemical Composition: Acrylated urethane Color: Clear Components: 1 part Cure System: UV Cure Time: UV Cure: Up to 15s depending on lamp intensity, distance from the light source, and required depth of cure; Heat Cure: 60min @ 110 °C Dielectric Strength: 500 kV/mm Elongation: 150% @ break Flash Point: 101 °C Hardness: 45 D Service Temperature: -54 °C to 150 °C Tensile Strength: 750 psi @ break Viscosity: 17,000 Volume Resistivity: 555 x 10^12 ohm-cm -
SDS / TDS