Part number: EE-3200 PART A .5KG Manufacturer SKU: 4121014
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DescriptionDow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part A, 0.5 kg Jar.
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Product Details
Typical Use: Used as a low stress encapsulant to lessen internal stress generation, improve manufacturing speed, and fill small gaps on electronic devices. EE-3200 can be used on automotive electronics modules, junction boxes, and power conversion devices. Brand: DOWSIL Chemical Composition: Polydimethylsiloxane Color: Off-White Components: 2 part Cure System: Room Temperature/Heat Cure Time: 3h @ 25 °C; 20min @ 50 °C Dielectric Strength: 350 V/m Elongation: 340% Flash Point: >101.1 °C Hardness: 20 OO Mix Ratio: 1:1 Specific Gravity: 1.48 Tensile Strength: 33 psi Thermal Conductivity: 0.5 W/mK Viscosity: 1,400 Volume Resistivity: 1e + 15 ohm-cm Working Time: 30min @ 25 °C -
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