Part number: TP-2160Manufacturer SKU:
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DescriptionResin Designs TP-2160 Thermal Gap Pad is a cost-competitive, highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability. It is ideal for use in low-power applications requiring heat transfer across any large air gap.
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Product Details
Tacky 2 side Hardness,Shore 00 70 max Compressio n Deflecti on at 20% psi 21.3 Specific Gravity 1.82 Thermal Conductivity W/m°k,min 0.73 Tear Strength,0.5mm.thickness lb./in - Weight Loss,after 336 hr.at 150°C,% 1 max Volume Resistivity 10 EXP 11 min UL 94 Rating/Cert File # QMFZ2.E177248 Thickness(mm):1.5-4.0 UV94:V1
Thickness(mm):4.6-5.3 UV94:V0
Storage Because these are precured materials, there is no special storage condition or usage date required. The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials. Applications Switching devices
Automatic power boards
Microinverters
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SDS / TDS
TDS TP-2160
