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DescriptionHenkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal expansion, non-sagging, versatility, low stress bonds, and excellent thermal cycling properties. 1 gal Pail.
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Product Details
Typical Use: Used for bonding metals and ceramic substrates in heat sink applications or any application that requires a thermally conductive adhesive. Brand: Ablestik Chemical Composition: Epoxy Color: Black Components: 2 part Cure Time: Catalyst 9: 16 to 24h @ 25 °C; 11: 8 to 16h @ 80 °C; Catalyst 23LV: 16 to 24h @ 25 °C Dielectric Strength: Catalyst 9: 17.7 kV/mm; Catalyst 11: 17.7 kV/mm; Catalyst 23LV: 17.7 kV/mm Flash Point: >93.3 °C Mix Ratio: Catalyst 9: 100:8.5 by volume, 100:3.5 by weight; Catalyst 11: 100:9.9 by volume, 100:4 by weight; Catalyst 23LV: 100:17 by volume, 100:7.3 by weight Service Temperature: Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; Catalyst 23LV: -65 to 105 °C Shear Strength: Catalyst 11: 2,100 @ 25 °C Specific Gravity: 2.4 Thermal Conductivity: Catalyst 9: 1.44 W/mK; Catalyst 11: 1.44 W/mK; Catalyst 23LV: 1.22 W/mK Viscosity: Thixotropic paste Volume Resistivity: Catalyst 9: 1 x 10^15 ohm-cm; Catalyst 11: 1 x 10^15 ohm-cm; Catalyst 23LV: 1 x 10^15 ohm-cm Working Time: Catalyst 9: 45min; Catalyst 11: 4h; Catalyst 23LV: 60min -
SDS / TDS