Part number: TC-4525 A/B 3.2KG KIT Manufacturer SKU: 4119574
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DescriptionDow DOWSIL™ TC-4525 Thermally Conductive Gap Filler is a two component, room temperature curing, silicone gel that is used to dissipate heat from electronic components. It offers long term stability, reliable cooling performance, and provides dielectric insulation. 3.2 kg Kit.
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Product Details
Typical Use: Used to dissipate heat from electronic components. Brand: DOWSIL Chemical Composition: Silicone Color: Part A: White; Part B: Blue Components: 2 part Cure System: Room Temperature Cure Time: 120 min @ 25 °C; 20 min @ 50 °C; 10 @ 80 °C Dielectric Strength: 18 kV/mm Hardness: 55 OO Mix Ratio: 1:1 Service Temperature: -45 to 150 °C Specific Gravity: 2.9 Thermal Conductivity: 2.6 W/mK Viscosity: Part A: 207; Part B: 193; Mixed: 217 Volume Resistivity: 2.4e + 14 ohm-cm Working Time: 40 min @ 25 °C -
SDS / TDS
