Part number: ME-543 10CC EFD (8GM) Manufacturer SKU: 3019484
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DescriptionLORD® CoolTherm™ ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand 260 °C peak reflow temperatures of lead-free solders. 10 cc Syringe.
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Product Details
Typical Use: Used for encapsulating densely populated area array flip chip devices. Brand: CoolTherm Chemical Composition: Epoxy resin Color: Black Components: 1 part Cure System: Heat Cure Time: 7 to 20min @ 160 to 165 °C Flash Point: ≥93 °C Specific Gravity: 2.2 Thermal Conductivity: 1.2 W/mK Viscosity: 21,000 Volume Resistivity: 1 x 10^15 ohm-cm -
SDS / TDS
