Part number: THRMLT865B-P42PManufacturer SKU:
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DescriptionBostik Thermelt 865 Hot Melt Adhesive Black is a polyamide resin with excellent adhesion and good brittleness resistance at low temperatures. Non reactive and solvent free. 44 lb Case.
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Product Details
Typical Use: Used for low pressure molding of electronic/electric components, connectors and cables. Brand: Thermelt Color: Black Components: 1 part Cure System: Room Temperature Elongation: >200% Flash Point: >204.4 °C Hardness: 31 D Hot Melt Type: Pellets & Pillows Service Temperature: -55 to 120 °C Tensile Strength: 435.1 psi Thermal Conductivity: 0.2 W/mK @ 23 °C; 0.6 W/mK @ 180 °C Viscosity: 3000 @ 210 °C -
SDS / TDS
