Part number: EP750 BLACK 50MLManufacturer SKU:
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DescriptionResinLab EP750 Black is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
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Product Details
Typical Use: This product has good wetting and adhesion to most surfaces. This product has a free flowing viscosity. It has very good resistance to water, acids and bases and most organic solvents. Chemical Composition: Part A: Epoxy resin; Part B: Polyamide blend Color: Black Components: 2 part Cure System: Heat Cure Time: 24 to 72h @ 25 °C; 15m @ 100 °C; 1h @ 65 °C Dielectric Strength: 410 V/mil Elongation: 5% to 7% Flash Point: >93.3 °C Hardness: 65 to 80 D Key Specifications: Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymeric coatings). Mix Ratio: 1:1 by volume Service Temperature: -40 to 150 °C Shear Strength: 1,550 to 2,500 Specific Gravity: Mixed: 1.03 to 1.07 Tensile Strength: 7,500 psi Viscosity: Mixed: 14,500 to 15,000 Volume Resistivity: 8.3 x 10^14 ohm-cm Working Time: 45 to 60min -
SDS / TDS
