Sekisui TIMLIGHT™ thermal pads are soft, silicone-based sheets engineered for efficient heat dissipation in advanced electronics. With a thermal conductivity range of 1.2–5.0 W/m·K, they offer flexibility and compressibility to ensure reliable contact on uneven surfaces, while maintaining low thermal resistance, strong electrical insulation, and UL94 flame retardancy. Their tacky, reworkable surface allows for easy handling and assembly, providing long-term reliability in demanding environments.

Sekisui CGW series is a two-component thermal grease that cures at room temperature to deliver strong adhesion, soft elasticity, and low thermal resistance. With thermal conductivity levels up to 6.0 W/m·K, it provides stable gap filling and consistent performance under thermal cycling. The dual-cartridge design ensures easy dispensing and application, while its paste-like texture promotes precise, reliable coverage for long-term durability.

Sekisui 3D Thermal Gap Pads are moldable, reworkable thermal interface. Featuring a soft, low-hardness design for minimal stress, they provide excellent thermal conductivity, strong electrical insulation (≥10 kV/mm), and UL94 V-0 flame retardancy. The pads can be molded into custom 3-dimensional shapes, allowing them to conform tightly to uneven surfaces and reduce thermal contact resistance. With a wide operating range (−40 °C to +150 °C), low compression set, and precise 3D conformability, these pads deliver safe, reliable, and flexible heat management for high-power automotive and electronic applications. Custom shapes and thicknesses are available upon request, enabling optimized designs for complex product geometries.

Sekisui MANION™ sheets utilize magnetic-field aligned carbon fibers to achieve ultra-high thermal conductivity up to 45 W/m·K in thin, stable profiles. They combine excellent heat transfer, mechanical strength, and flame retardancy, while maintaining reliability across wide temperature ranges (up to 200 °C in HST grades). Available in tacky and non-tacky formats, they are engineered for superior thermal stability and minimal contact resistance.