When: Monday, September 23, 2019 04:30 PM Onwards (flollowed by cocktail dinner)

Where: Holiday Inn New Delhi International Airport

Description:

YOU ARE INVITED

Ellsworth Adhesives India is partnering with Henkel AGI – Industrial Assembly Team in India for Technical Seminar on Low Pressure Molding Technologies with Technomelt material from Henkel and equipment Solutions from Moldman & Winstar.

We are introducing this technology to our customers for their new potential applications in Cable & Connectors,  Automotive , Electronics , White Goods consumer Appliances and other Industrial Market segments.

Please do visit us to see the live demonstrations and talk to expert to know more about products and application details.

For more details, please click on the Invitation, thank you!