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    Henkel’s TECHNOMELT® Low Pressure Molding Solutions for PCB

     

    Source:Loctite.com / Editor:Ellsworth Adhesive


    Henkel’s TECHNOMELT® low pressure molding materials are a single-material solution that delivers a simple, streamlined and low-cost alternative to multi-step, multi-material PCB protection methods. A three-step process where parts are inserted into the moldset, molded and tested, low pressure molding eliminates messy two-part material mixing routines, device preparation (masking), long cure times and material waste.


    CIRCUIT BOARD PROTECTION TECHNOLOGY COMPARISON

     

    Traditional CBP Materials Material Challenges TECHNOMELT Low Pressure Molding Solutions
    Potting

    ● Two-part systems; mixing required

    ● Non-reworkable

    ● Large equipment investment and footprint

    ● 24 – 72 hours cure schedule

    ● Up to 8 process steps

    ● 5 – 7 BOM part numbers in inventory

    ● One part; no mixing

    ● Reworkable

    ● Weight reduction

    ● Low waste

    ● 30 sec. – 2 min. cycle times

    ● Strain relief

    ● Green technology; no VOC

    Sealing

    ● Limited by housing dimensions; space constraints

    ● 48 – 72 hours cure schedule

    ● Up to 6 process steps

    ●5 – 7 BOM part numbers in inventory

    ● No housing; fewer part numbers

    ● Only 3 process steps

    ● Improved aesthetic appearance; skylining

    ● Only 1 BOM part number required

    ● In-line and high-volume processing

    Conformal Coating

    ● Very limited mechanical strength

    ● 4 – 12 hours cure schedule

    ● Up to 8 process steps

    ● 3 – 4 BOM part numbers in inventory

    ● No cure

    ● Temperature, vibration, impact and chemical resistance

    ● Watertight encapsulation

    ● Good mechanical strength

    ● Translucent materials available for optical inspection

     


    References: https://dm.henkel-dam.com/is/content/henkel/lt-4182-brochure-technomelt-low-pressure-molding-solutions